TSMC Unveils Groundbreaking A16 Technology at 2024 North America Technology Symposium
Taiwan Semiconductor Manufacturing Company (TSMC) announced its latest 1.6nm technology, A16, at the 2024 North America Technology Symposium in California. The chip foundry plans to start mass production using this new manufacturing process in 2026.
The cutting-edge technology combines advanced nanosheet transistors with backside power rail solutions to improve logic density and chip performance. Compared to the N2P process, A16 offers significant improvements in speed, power consumption, and density. It promises an 8-10% increase in speed at the same operating voltage, a 15-20% reduction in power consumption at the same speed, and up to 1.1 times more density to support data center products.
TSMC’s commitment to pushing the boundaries of chip technology is evident in this groundbreaking innovation. The unveiling has generated excitement within the tech community, as A16 is poised to revolutionize the semiconductor industry with its impressive performance enhancements and density improvements. With this new standard for chip manufacturing processes, TSMC positions itself as a leader in the global semiconductor market.
