Rapidus secures $3.9 billion in government funding for 2nm and multi-chiplet technologies

Japanese Technology Company Rapidus Developing 2nm Process Technology with Government Support

Rapidus, a Japanese technology company, is working on developing 2nm process technology with plans to launch it commercially in 2027. In order to support its ongoing projects, the Japanese government has provided Rapidus with a substantial grant of ¥590 billion yen ($3.89 billion). This funding will go towards developing the 2nm production node and purchasing cleanroom equipment, as well as the development of multi-chiplet packaging technology.

Rapidus’ CEO, Atsuyoshi Koike, has outlined the company’s timeline for commercial production of 2nm chips to begin in April 2025 and large-scale production by 2027. The company is also focusing on advanced packaging technology for multi-chiplet System-in-Packages (SiPs), and has received more than ¥50 billion ($329.85 million) specifically allocated for research and development in this area. Additionally, Rapidus is using a portion of Seiko Epson Corporation’s Chitose Plant for its back-end packaging processes, which is located in close proximity to the company’s fab currently under construction in Bibi World. Despite the hefty project cost estimate of around ¥5 trillion ($32.983 billion), Rapidus is hopeful that with the backing of the Japanese government and support from prominent Japanese companies like Toyota Motor and Nippon Telegraph and Telephone, it will secure enough financing to move forward.

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